The Garnet™ adaptable laser platform is ESI’s low cost of ownership platform built in China for fast delivery to Chinese manufacturing. Optimized to deliver high volume production throughput for laser marking, laser cutting, laser engraving, laser drilling and advanced PCB singulation at the highest accuracy of a mid range laser. The platform takes advantage of ESI’s built-in-design extendibility for multiple lasers, optics and stage configurations to meet the short ramp time needed to build your next device. The Garnet can be easily configured to accommodate a wide variety of laser sources with different powers, wavelengths and pulse widths, from nanosecond to femtosecond, to optimize processes for a broad spectrum of materials. An ESI-proprietary real-time control system synchronizes the timing of laser pulses with laser beam positioning and movement of the work surface.