ACCRETECH PG3000RMX

  • Specifiche
    Controllo
    CNC
  • Descrizione del prodotto

    The RM200/300 offers a single-unit solution supplementing PG200/300 processing with additional functionality to remove protective tape from thinner wafers and apply wafers to dicing frames.
    Performs the processes of the rough grinding, fine grinding, polishing and cleaning wafers on the both sides in a single machine.
    All the processes are completed without moving the wafer on the same chuck table.
    The smallest footprint in the world.
    Environmental - friendly - subsurface damage reduction without chemicals.


    Brochure modello (1.31 MB)

  • Circa la società
    Accretech - Tokyo Seimitsu Co., Ltd

    Tokyo Seimitsu is, with us along with the wide range of people to both the "aspirations", to fuse technology with is each other, wisdom, information, let us create the world's No.1 products, and I decided. As a sign of this commitment, we introduced a ACCRETECH as a new corporate brand. This is a coined word that coalesce pronounced Accretech, "Accrete" and "Technology". The former refers to the "coexistence", it means the latter is the "technology". Companies, the State, beyond the boundaries of the region, to bring together the world's best technology to challenge the various challenges, and grow. This is what, is a new business form of increasing development in the 21st century, and we are confident.


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