ACCRETECH ML300EXWH

型號
ML300EXWH
品牌
控制系統
  • 規格
    參數轉換為英制
    工作臺寬(W)
    304.8 mm
    工作臺長(L)
    304.8 mm
    控制系統
    數控
  • 產品概述

    12-inch laser dicing machine with wafer handling system achieved high performance to respond to various customer’s needs.


    型號說明書 (434.7 KB)

  • 關於公司
    Accretech - Tokyo Seimitsu Co., Ltd

    Tokyo Seimitsu is, with us along with the wide range of people to both the "aspirations", to fuse technology with is each other, wisdom, information, let us create the world's No.1 products, and I decided. As a sign of this commitment, we introduced a ACCRETECH as a new corporate brand. This is a coined word that coalesce pronounced Accretech, "Accrete" and "Technology". The former refers to the "coexistence", it means the latter is the "technology". Companies, the State, beyond the boundaries of the region, to bring together the world's best technology to challenge the various challenges, and grow. This is what, is a new business form of increasing development in the 21st century, and we are confident.


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